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Improve hard ware design to make sure CPU heat sink mounted horizontally

IP.com Disclosure Number: IPCOM000237361D
Publication Date: 2014-Jun-16
Document File: 3 page(s) / 177K

Publishing Venue

The IP.com Prior Art Database

Abstract

A new E-clip and back plate structure are created to generate the pre-assembly connection. This kind of clutch connection can make sure the CPU heat sink will not be leaning during the screw driving down process.

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Improve hard ware design to make sure CPU heat sink mounted horizontally

Industry uses screw + spring or lever on retention module method to mount CPU heat sink. The problem is that even industry drive the screw in diagonal cross, CPU over heat defects still come out because CPU heat sink was not well mounted. Industry solution is drive the screw in diagonal cross.

An new E-clip and back plate structure are created to generate the pre-assembly connection.This kind of clutch connection can make sure the CPU heat sink will not be leaning during the screw driving down process.

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- A new E-clip and back plate structure are created. Figure 1 shows the concept of new E-clip, stand off on back plate and how it works.

- New Clip adds some (quantity=3 in the picture) bent edges evenly distributed. At the end of the bending, add a protruding to make the end look like a hook. At the same time, add a cone pump on the outer surface of stand off. The new Clip can clutch the stand off after putting the heat sink in proper position with a slight push force. This kind of clutch connection can make sure that the CPU heat sink will not lean during the screw driving down process.

- After driving down the screw, the Protruding on Clip will be lower than cone bump on stand off (See "gap" in Figure

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5), so it will not impact the clip force generated by spring. Figure 2 shows the pre-mounting (new clip clutch on the stand off ) and after mounting status.

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