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New Inspection Design and Method for Adhesive Bonding Applications

IP.com Disclosure Number: IPCOM000237408D
Publication Date: 2014-Jun-17
Document File: 4 page(s) / 25K

Publishing Venue

The IP.com Prior Art Database

Abstract

A new inspection design and method is presented for the bonding of parts using thermal bonding films (TBFs) or liquid adhesives. The design and method include the formation of an inspection window in the part. The TBF’s die-cut design and the liquid adhesive dispensing route design are re-designed to coincide with the periphery of the inspection window. During the bonding process, the melted TBF film or the liquid adhesive can be visually observed to evenly flow into the inspection window. Upon inspection, if this is not the case, the bonding process is unstable and likely generating defective bonds. Appropriate correction to the process can then be made with minimal defective parts being generated. As all of the parts have the inspection window, 100% of the parts can be visually inspected in a timely manner.

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Page 01 of 4

New Inspection Design and Method for Adhesive Bonding Applications

Abstract:

    A new inspection design and method is presented for the bonding of parts using thermal bonding films (TBFs) or liquid adhesives. The design and method include the formation of an inspection window in the part. The TBF's die-cut design and the liquid adhesive dispensing route design are re-designed to coincide with the periphery of the inspection window. During the bonding process, the melted TBF film or the liquid adhesive can be visually observed to evenly flow into the inspection window. Upon inspection, if this is not the case, the bonding process is unstable and likely generating defective bonds. Appropriate correction to the process can then be made with minimal defective parts being generated. As all of the parts have the inspection window, 100% of the parts can be visually inspected in a timely manner.



Page 02 of 4

Introduction:

     Thermal bonding films (TBFs) or liquid adhesives are often used for structural bonding or joint bonding and may even replace welds, in some applications. These products are widely used for mobile communication equipment assembly processes, including applications in mobile handheld devices (e.g. phones), laptop computers, electronic notebooks, electronic pads, cameras and so on.

   In bonding applications using TBFs or liquid adhesives, heat, pressure and time are the key factors in obtaining a reliable bond. By selecting the process conditions accordingly, the thermal bonding film or adhesive will be transformed into a liquid phase first, flow and then fill and adequately wet the required area of bonding, prior to being cooled or cured to obtain a solid phase. Thus, the flowing and wetting of the adhesive can be used to judge if the adhesive has achieved an acceptable bond.

   The new inspection design is a visible inspection technique suited for mass-production, enabling the monitoring of the bonds of all parts in a timely manner. 100% of the parts being bonded can be inspected and the approach will be helpful in mass production settings, enabling improved process control of the bonding process. It also provides the ability to quickly identify any defective bonds and rectify the defective bonding process. This should decrease customer's production costs and increase productively. The method could decrease customer complaints with respect to the TBFs and liquid adhesives used in the bonding process.

Inspection Design and Inspection Method:

   The inspection design starts with the design of the part to be bonded, the die-cut design of the TBF or the dispensing route design for a liquid adhesive.

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