Browse Prior Art Database

High Density Omnidirectional Oring FET Assembly

IP.com Disclosure Number: IPCOM000237758D
Publication Date: 2014-Jul-09
Document File: 2 page(s) / 142K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a design that minimizes Printed Circuit Board (PCB) real estate by utilizing an array of smaller devices with high efficiency packaged in a dense array, to provide high density and performance.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 80% of the total text.

Page 01 of 2

High Density Omnidirectional Oring FET Assembly

Most power supplies have oring Field Effect Transistors (FETs) on the output to provide fault isolation in N+1 architectures. In high current outputs, this normally requires a single large device or multiples, which take up a considerable amount of real estate. In addition, the larger devices are usually more lossy, requiring larger heatsinks.

The novel concept is to minimize board real estate by utilizing an array of smaller devices with high efficiency packaged in a dense array. Smaller high-performance devices are used in a compact array to provide high density and performance. Rows of devices are created using heavy copper with photoresist and Hot Air Solder Leveling (HASL) for component mounting. Wafers are ganged together to form a monolithic device that can then be mounted to a Printed Circuit Board (PCB) using the normal PCB assembly process. Holes are located in the heatsink to allow air to circulate in multiple directions.

Construction Details:


1. Base material is etchable copper with photo resist

A. Photoresist is used to define component mounting surface which has

HASL or similar

    B. Exposed copper is used as heatsink surface. Holes are etched to create omidirectional use 2. Components mounted using normal PCB process to each "wafer". The wafer can contain any number of devices (see figures)


3. Multiple wafers ganged together for application

A. Pins are used to align wafer to wafer. Process on Record (PO...