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Lid Form Test Chuck Thermal Unit for Flip-chip Manufacturing

IP.com Disclosure Number: IPCOM000237759D
Publication Date: 2014-Jul-09
Document File: 3 page(s) / 174K

Publishing Venue

The IP.com Prior Art Database

Abstract

A Lid form test chuck from the thermal head test contactor to the lid of a flip-chip package will enable flat surface contact reducing package warpage and leading to better thermal testing conditions. The design allows contact at both the foot and top of the lid to enable flat surface contact through product testing. The lid form chuck will have the form of and fit over the package lid. It can be attached to any thermal test design and/or apparatus. The lid form test chuck thermal head will contact foot and top of package lid and thereby balance the forces over the entire setup, eliminating warpage. It will be made from a custom mold to ensure form contour shape of both the lid and foot. Sizing can be facilitated with the exact mechanical outline drawing of the package lid. The lid form test chuck ensures package warpage control whereas universal test contactors do not control package warpage. Package warpage is vital to thermal control during component final testing. Currently, the thermal head of the chuck to test flip-chip substrates at customer-requested temperatures is flat and smaller than the size of most flip-chip lids (see Figure 1). The chuck only covers a small center portion of the top of the lid.

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Lid Form Test Chuck Thermal Unit for Flip-chip Manufacturing

Abstract

A Lid form test chuck from the thermal head test contactor to the lid of a flip-chip package will enable flat surface contact reducing package warpage and leading to better thermal testing conditions.  The design allows contact at both the foot and top of the lid to enable flat surface contact through product testing.  The lid form chuck will have the form of and fit over the package lid.  It can be attached to any thermal test design and/or apparatus.

The lid form test chuck thermal head will contact foot and top of package lid and thereby balance the forces over the entire setup, eliminating warpage.  It will be made from a custom mold to ensure form contour shape of both the lid and foot.  Sizing can be facilitated with the exact mechanical outline drawing of the package lid.  The lid form test chuck ensures package warpage control whereas universal test contactors do not control package warpage. Package warpage is vital to thermal control during component final testing.

Currently, the thermal head of the chuck to test flip-chip substrates at customer-requested temperatures is flat and smaller than the size of most flip-chip lids (see Figure 1).  The chuck only covers a small center portion of the top of the lid.

Figure 1: Current Test Contactor Method

The force of the chuck/thermal head apparatus on the center of the lid can cause warpage in the package.  Multiple test inserts or contact touchd...