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SFP-small foot print package

IP.com Disclosure Number: IPCOM000237968D
Publication Date: 2014-Jul-23
Document File: 3 page(s) / 75K

Publishing Venue

The IP.com Prior Art Database

Abstract

In current PCBs, all components are arranged side-by-side. This may consume a lot of area on the PCB. PCB area can be reduced if some of the components are arranged vertically.

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SFP-small foot print package

Abstract: 

In current PCBs, all components are arranged side-by-side.  This may consume a lot of area on the PCB.  PCB area can be reduced if some of the components are arranged vertically.   

Body:   

PCB (Printed Circuit Board) space is very important for some apparatus and devices.  In this paper, we present a method of reducing PCB area, which would allow devices in which the PCB are used to be reduced in size. 

We propose that an IC may act like a bridge, one side having I/Os, and the other being a thermal plank. Between the two sides, there is a hollow area just like a span within which passive components or other chips (e.g., QFN or BGA non-lead package, etc. ) may be located.  The components proposed here are: 

•          SFP_Small Foot Print Package that has a bridge, where one side has I/Os and the other side has a thermal plank or heat sink;

•          The thermal plank is not only for thermal dissipation but also for support and balance.

•          SFP_Small Foot Print Package with Thermal Plank design

That is, we propose a vertically oriented integrated circuit package that has package leads on one side surface and a heat sink on an opposing side surface.  We call this package a SFP (small foot print) package.  After the SFP package is mounted on a PCB, it is bent 90° or folded over so that the heat sink or thermal plank also can be attached to the circuit board. (Such leads bending can either do in IC assembly site or do in SMT site.) The...