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Modular / Interchangeable Heat Sink Attach System / Method

IP.com Disclosure Number: IPCOM000238077D
Publication Date: 2014-Jul-31
Document File: 5 page(s) / 802K

Publishing Venue

The IP.com Prior Art Database

Abstract

Current heat sink attachment methods of a heat sink to a flip chip plastic ball grid array (FCPBGA) package require at attachment method that is supported by the motherboard, or use of an adhesive thermal interface material (TIM) to adhere the heat sink directly to package. This disclosure proposed a new novel heat sink attachment method that allows an easy way to both attach and remove an external heat sink from a board-mounted FCPBGA package. The system consists of a lid and standardized base that the hit sink fits into with a similar mating type of base with a “dovetail” style joint. The system also allows easy interchange of heat sink sizes, which can be advantageous in applications where a customer needs to try out different sizes of heat sink to determine best heat sink for the system. This connection method also can work well in an experimental design situation. This connection method allows changing heat sinks without disturbing the thermal connection / base / TIM interface to the package / IC component.

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Title:               Modular / Interchangeable Heat Sink Attach System / Method

Abstract:  Current heat sink attachment methods of a heat sink to a flip chip plastic ball grid array (FCPBGA) package require at attachment method that is supported by the motherboard, or use of an adhesive thermal interface material (TIM) to adhere the heat sink directly to package.  This disclosure proposed a new novel heat sink attachment method that allows an easy way to both attach and remove an external heat sink from a board-mounted FCPBGA package.  The system consists of a lid and standardized base that the hit sink fits into with a similar mating type of base with a “dovetail” style joint.  The system also allows easy interchange of heat sink sizes, which can be advantageous in applications where a customer needs to try out different sizes of heat sink to determine best heat sink for the system.  This connection method also can work well in an experimental design situation.  This connection method allows changing heat sinks without disturbing the thermal connection / base / TIM interface to the package / IC component.

Body:  Customers of network processor type IC components often use devices packaged in Flip Chip Plastic Ball Grid Array (FCPBGA) packages.  These products are often higher-power-dissipating products that require the attachment of additional external heat sinks to the top of the package to provide additional cooling.  Figure 1 shows a diagram of a typical FCPBGA with a lid covering the silicon chip.  These heat sinks are typically attached to the FCPBGA package lid either with an adhesive directly to the package lid or with a mounting that is supported by the motherboard.  Figures 2 and 3 show diagrams of typical heat sinks attached to the package and supported either by a spring clip mounting to motherboard (figure 2) or adhered directly to the FCPBGA lid (figure 3).

The traditional attachmen...