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Enhanced Stacked Die Package

IP.com Disclosure Number: IPCOM000238079D
Publication Date: 2014-Jul-31
Document File: 4 page(s) / 921K

Publishing Venue

The IP.com Prior Art Database

Abstract

A lead frame based semiconductor package and method of manufacturing are disclosed. The lead frame has a window type exposed paddle. An embedded substrate interposer serves as a die attach platform. A first silicon die is electrically connected to inner leads of the lead frame and to bonding fingers of the substrate. The first die is encapsulated with part of the die exposed. An external package is mounted on the exposed side of the substrate interposer. The package is singulated by normal or reverse forming options and thermally enhanced by the addition of a heat spreader attached with a thermal adhesive during assembly or SMT (Surface Mount) process, and further by linking the bottom of the package to the board land.

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Enhanced Stacked Die Package

ABSTRACT

A lead frame based semiconductor package and method of manufacturing are disclosed.  The lead frame has a window type exposed paddle.  An embedded substrate interposer serves as a die attach platform.  A first silicon die is electrically connected to inner leads of the lead frame and to bonding fingers of the substrate.  The first die is encapsulated with part of the die exposed. An external package is mounted on the exposed side of the substrate interposer.  The package is singulated by normal or reverse forming options and thermally enhanced by the addition of a heat spreader attached with a thermal adhesive during assembly or SMT (Surface Mount) process, and further by linking the bottom of the package to the board land.

 

Miniaturization of electronic devices is an inherent driving force that leads designers to maximize the use of all available board space. A need for advanced semiconductor packaging design with high performance and complex functional capability is required to meet continuing space restrictions.  Hybrid structures combining different package platform bases have become popular to address such challenges. Interconnected vertical package stacking is an alternative solution, due to its high functional complexity in a single package footprint.

Referring to the below drawings, the structure is composed of a standard exposed pad lead frame design in which the paddle or flag middle part is fully opened (1). A substrate interposer (2) with the same dimension as the lead frame paddle is attached on the top side of the paddle with the use nonconductive adhesive materials (3) in such a way that the substrate bonding fingers are facing up and the ball pad side is fully exposed in the window opening of the paddle.  Nonconductive adhesive material (4) is also used...