Browse Prior Art Database

3D High I/O Density Package Structure

IP.com Disclosure Number: IPCOM000238439D
Publication Date: 2014-Aug-26
Document File: 2 page(s) / 258K

Publishing Venue

The IP.com Prior Art Database

Abstract

With system integration at the package level to improve IC device performance, high IO density is necessary. The traditional package with limited IO becomes the bottleneck of the system integration in package. This paper is about a 3D package structure with multiple dies stacked inside that can provide high IO density to enable complex functionality and high efficiency of the IC device.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 78% of the total text.

3D High I/O Density Package Structure

Abstract: 

With system integration at the package level to improve IC device performance, high IO density is necessary. The traditional package with limited IO becomes the bottleneck of the system integration in package. This paper is about a 3D package structure with multiple dies stacked inside that can provide high IO density to enable complex functionality and high efficiency of the IC device.  

Body:  

PCB space is critical for many devices such as sensor and entertainment devices.  We present a package structure that allows for a small package size, which enables smaller devices as a whole.

On the other hand, in most cases of large scale integrated apparatus design, for example, in a typical IC tester electronic frames, there are many connecting cables, slot, socket designed to achieve signal communication which make the signal transfer delay unavoidable, the purpose of the proposed package structure is to reduce the number of connector assembly used through the 3D packaging, thus the signal delay may be reduced, the electrical performance improved and system integration improved too.

Process flow and feasibility study:

3D package with I/O pads located on 3 sides/ surface of the package.

Multiple dies were stacked together with silicon spacers which are recessed from the edge of the dies above and below.

The bond pads of the dies, other than the bottom one, are connected with the solder pad on the package surface (perpendicula...