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Method and System of using High Pressure Water Cleaning for Removing Flux Residues on Interposers in Die Stacks

IP.com Disclosure Number: IPCOM000238475D
Publication Date: 2014-Aug-27
Document File: 5 page(s) / 262K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and system is disclosed for using high pressure water cleaning for removing flux residues on interposers in die stacks.

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This is the abbreviated version, containing approximately 55% of the total text.

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Method and System of using High Pressure Water Cleaning for Removing Flux Residues on Interposers in Die Stacks
During removal of flux residues on interposers in a large die stack such as a 3 dimensional (3D) or a 2.5 dimensional (2.5D) die stack, the interposers tend to be damaged. The die stack is made of, but need not be limited to, a silicon die. The interposers are made of, but need not be limited to, silicon, glass and an organic material. Fig. 1 illustrates damage on the interposer.

Figure 1

Disclosed is a method and system for using high pressure water cleaning for removing flux residues on interposers in die stacks.

The method and system provides a fixture assembly for cleaning the flux residues on the interposers using the high pressure water cleaning. The high pressure is, but need not be limited to, 80 pounds per square inch (psi). Fig. 2 illustrates high pressure water nozzles used in cleaning the flux residues.

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Page 02 of 5

Figure 2

The fixture assembly is capable of being used for cleaning flux residues on interposers with bumps at its bottom or interposers without bumps at its bottom. Different types of bumps at the bottom of the interposers are, but need not be limited to, C4 bumps or microbumps at its bottom.

Fig. 3 illustrates a comparison of the interposer with the C4 bumps or the microbumps at its bottom and the interposer without the C4 bumps or the microbumps at its bottom.

Figure 3

Fig. 4 illustrates the fixture assembly for accommodatin...