Browse Prior Art Database

A multi-stage assembly for temperature dependent warpage measurements on flip-chip electronic packages and components using a Digital Image Correlation (DIC) technique

IP.com Disclosure Number: IPCOM000238818D
Publication Date: 2014-Sep-19
Document File: 2 page(s) / 79K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to improve the tool productivity of the Digital Image Correlation (DIC) by fitting a linear stage to the main oven.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 51% of the total text.

Page 01 of 2

A multi-stage assembly for temperature dependent warpage measurements on flip -chip electronic packages and components using a Digital Image Correlation (DIC) technique

Many samples for flip-chip packages need warpage measurement in a heated environment. Collecting this data is important for understanding laminate and package thermo-mechanical behavior. Warpage occurs naturally in laminates; therefore, to understand and prevent failures at chip join and many of the manufacturing operations, it is important for the product to be successful.

The common process for warpage measurement of laminates and modules uses a Digital Image Correlation (DIC) tool in conjunction with an oven. One known solution places multiple parts in the DIC oven with a large glass window and indexes the DIC cameras. This solution warps the glass and disturbs the camera calibration. Hence, this solution is not preferred. Another approach increases the measurement window in the oven. This solution lowers the measurement resolution and warps the glass window. Using a thicker glass distorts the image. Hence, this solution is not preferred.

The novel contribution is a method to improve the tool productivity of the DIC by fitting a linear stage to the main oven. The linear stage (a.k.a multi-stage) facilitates the measurement of multiple parts within the oven under the same temperature profile cycle. In order to increase the use of the DIC heated chamber and three-dimensional (3D) camera as a means of capturing warpage, the method design includes a multi-stage unit that enables the simultaneous measurement of multiple parts. Increasing data collection for the software modeling enables an earlier and faster collection of warpage data.

Originally, the data included one sample per thermal recipe. The multi-stage method increases the data collection productivity and reduces the workload queue at the tool. A multi-stage unit is fitted to the DIC thermal chamber to hold as many as three samples. The sample size is configured with the use of pins to hold many sizes of laminate and can hold up to...