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Flexible Pressure Sensor Package

IP.com Disclosure Number: IPCOM000239006D
Publication Date: 2014-Sep-30
Document File: 3 page(s) / 41K

Publishing Venue

The IP.com Prior Art Database

Abstract

Packaging pressure sensors is a challenge. The pressure sensor die cannot be entirely covered with the mold compound. There need to be an opening to expose the diaphragm of the pressure sensor die, without which impedes the functionality of the die. There are not many differentiations in the industry on pressure sensor packages. Common packages have metal lids and some have complicated designs which increase the overall cost of the package. The important components of this sensor package are the thin silicon wafer, pressure sensor die and silicone encapsulation material. The pressure sensor die is bonded to the silicon wafer in a flip chip manner. The overall package is flexible since is thin. The silicone encapsulation material is commercially available in the industry. This material is applied on the thin silicon wafer and die, covering the sensitive diaphragm of the pressure sensor die. It is then oven cured per the material recommended temperature profile. The wafer is then sawn into individual package size.

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TITLE

Flexible Pressure Sensor Package

ABSTRACT

Packaging pressure sensors is a challenge. The pressure sensor die cannot be entirely covered with the mold compound. There need to be an opening to expose the diaphragm of the pressure sensor die, without which impedes the functionality of the die. There are not many differentiations in the industry on pressure sensor packages. Common packages have metal lids and some have complicated designs which increase the overall cost of the package.  The important components of this sensor package are the thin silicon wafer, pressure sensor die and silicone encapsulation material. The pressure sensor die is bonded to the silicon wafer in a flip chip manner. The overall package is flexible since is thin. The silicone encapsulation material is commercially available in the industry. This material is applied on the thin silicon wafer and die, covering the sensitive diaphragm of the pressure sensor die. It is then oven cured per the material recommended temperature profile. The wafer is then sawn into individual package size.

CONTENT

Packaging pressure sensor can be a challenge depending on the complexity of the product and the number of dies required. Cavity based sensor packages are expensive to manufacture due to the many process steps involved to first form the cavity and then processed through the assembly to the final end product. Molding by forming a cavity around the individual unit and using of metal lids can be very costly. This incurs a cost of ~20% of the overall material cost, making the overall packaging cost to be not attractive. The other issue is the package thickness. With the molded cavity and metal lid, the package can be very thick ~ 2mm. This is at a disadvantage if the preference of our customers is geared towards thinner packages.

In this paper we present a flexible package that addresses these 2 issues. First, there is no molding required to form the deep cavity prior to start of package assembly. There is also no need for a thick metal lid. This alone will cut down tremendously on the packaging cost....