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Protection of electronic components via blister packaging

IP.com Disclosure Number: IPCOM000239009D
Publication Date: 2014-Sep-30
Document File: 4 page(s) / 343K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to prevent hardware failures due to harsh environments via blister packaging. Through the use of blister packaging, a component can be protected against chemical exposure, moisture penetration, and particulates, while allowing the component to operate normally under air or an inert gas.

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Page 01 of 4

Protection of electronic components via blister packaging

The electronics industry designs and tests hardware to be able to withstand typical indoor air environments. Recently, several hardware failures have occurred in geographies known to exhibit much harsher indoor air environments than the design set point. This has resulted in component failure due to corrosion of metallurgy via a corrosive gas environment. Attempts to mitigate these failures have focused on the use of commercially available conformal coatings. These conformal coatings fall into one of several generic classes: silicones, epoxies, acrylates, or other organic materials. However, accelerated aging testing has revealed that silicones may actually exacerbate the problem and that corrosion is merely retarded by the other classes of conformal coatings. Furthermore, studies have revealed that the major culprit in the gaseous environment is elemental sulfur, H2S, or sulfur oxides. Of these, elemental sulfur appears to be the most aggressive. Interestingly, when components are left exposed without a conformal coating in highly concentrated sulfur-bearing gases, they last far longer than that of coated components using silicone conformal coatings. Figure 1 below depicts resistor life data in FoS accelerated testing (105 C) without a conformal coating and with a standard silicone conformal coating. Note, no standard deviation present for non-coated resistor due to them passing beyond the 20 days of the test which is equivalent to 10+ years in the field.

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Page 02 of 4

Figure 1

    
The goal of this invention is to utilize blister packing technology [*] that can be generated, applied, and sealed over components to create a protective air gap between the protection layer to prevent corrosion due to chemical attack, moisture penetration, and particulate (see Figure 2 below). This would prevent the corrosive agents from reacting with the underlying component metallurgy, thus extending the product life.

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Page 03 of 4

Fig...