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NOVEL EPOXY RESIN COMPOSITIONS FOR COMPOSITE, ADHESIVE AND OTHER APPLICATIONS

IP.com Disclosure Number: IPCOM000239165D
Publication Date: 2014-Oct-17

Publishing Venue

The IP.com Prior Art Database

Abstract

Novel select epoxy resin compositions and novel select modifier containing epoxy resin compositions that provide exceptional epoxy polymer mechanical properties, and prepregs, resins, adhesives, films and composites formed therefrom are discussed. The novel select epoxy resin compositions comprise select epoxy resins and hindered-diamine curing agents, and optionally other components. Novel select modifier containing epoxy resin compositions comprise epoxy resins, hindered-diamine curing agents, select epoxy modifiers and optionally other components. Both of these epoxy resin compositions polymerize to provide epoxy polymers capable of having an exceptional combination of properties, for example, high glass transition temperature, high toughness, high mechanical properties and low moisture absorption These novel select epoxy resin compositions and novel select modifier containing epoxy resin compositions are suitable to make novel uncured materials of this invention, for example, are prepregs, lay-ups, resins, films, fillers, foams, coatings, surfacing materials, paste or film adhesives, encapsulates, lighting strike protection, components and the like. Methods to produce these novel uncured materials are discussed. Methods to process these novel uncured materials into novel cured materials using, for example, lay-ups, coatings, resins, adhesives, fillers, VARTM, RTM and the like into polymerized materials, for example, polymer matrix composites, epoxy polymers, adhesives, fillers, coatings, surfacing materials, foams, encapsulates, resins, lighting strike protection, components and the like are discussed. These novel cured materials based on novel select epoxy resin compositions and novel select epoxy modifier containing epoxy resin compositions can have an exceptional combination of properties, for example, high composite open hole compression strength and high composite impact damage tolerance, adhesive, encapsulate, lighting strike, filler and coating properties.

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   NOVEL EPOXY RESIN COMPOSITIONS FOR COMPOSITE, ADHESIVE AND OTHER APPLICATIONS

ABSTRACT

Novel select epoxy resin compositions and novel select modifier containing epoxy resin compositions that provide exceptional epoxy polymer mechanical properties, and prepregs, resins, adhesives, films and composites formed therefrom are discussed. The novel select epoxy resin compositions comprise select epoxy resins and hindered-diamine curing agents, and optionally other components. Novel select modifier containing epoxy resin compositions comprise epoxy resins, hindered-diamine curing agents, select epoxy modifiers and optionally other components. Both of these epoxy resin compositions polymerize to provide epoxy polymers capable of having an exceptional combination of properties, for example, high glass transition temperature, high toughness, high mechanical properties and low moisture absorption These novel select epoxy resin compositions and novel select modifier containing epoxy resin compositions are suitable to make novel uncured materials of this invention, for example, are prepregs, lay-ups, resins, films, fillers, foams, coatings, surfacing materials, paste or film adhesives, encapsulates, lighting strike protection, components and the like. Methods to produce these novel uncured materials are discussed. Methods to process these novel uncured materials into novel cured materials using, for example, lay-ups, coatings, resins, adhesives, fillers, VARTM, RTM and the like into polymerized materials, for example, polymer matrix composites, epoxy polymers, adhesives, fillers, coatings, surfacing materials, foams, encapsulates, resins, lighting strike protection, components and the like are discussed. These novel cured materials based on novel select epoxy resin compositions and novel select epoxy modifier containing epoxy resin compositions can have an exceptional combination of properties, for example, high composite open hole compression strength and high composite impact damage tolerance, adhesive, encapsulate, lighting strike, filler and coating properties.

FIELD OF INVENTION

Embodiments of the present disclosure relate to novel select epoxy resin compositions which comprise select epoxy resins, hindered-diamine curing agents and optionally comprise other components and materials and to novel select modifier containing epoxy resin compositions which comprise epoxy resins, hindered-diamine curing agents and select epoxy modifier and

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optionally comprise other components and materials, the novel uncured materials made therefrom, and the cured parts and novel cured materials made therefrom which exhibit exceptional mechanical properties and other exceptional properties.

BACKGROUND

Polymer Matrix Composites (PMCs) are a class of structural material which combines selectively oriented fibers with a reinforcing polymeric matrix. These composite structures exhibit good mechanical properties for their weight, includ...