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Monitoring Backside Pressure in a Chemical Vapor Deposition Tool

IP.com Disclosure Number: IPCOM000239168D
Publication Date: 2014-Oct-19
Document File: 2 page(s) / 39K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and system is disclosed of monitoring backside pressure for a chemical vapor deposition (CVD) tool.

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Monitoring Backside Pressure in a Chemical Vapor Deposition Tool

Monitoring of wafer backside pressure is crucial for Chemical Vapor Deposition (CVD) processing. If a failure mechanism such as a source of foreign material (FM) is introduced onto the heater table of a CVD tool, then the thermal transfer of backside pressure provided during deposition is disconnected resulting in thin to no deposition.

Disclosed is a method and system of monitoring wafer backside pressure for a CVD tool.

Figure 1 illustrates a comparison of a conventional design (Design A) and the design (Design B) for the method and system disclosed herein.

Figure1

As illustrated, in Design A, a flow signal (Al 157) is sent to an electronic backplane (Al 156). There is no Status Variable Identifier Data (SVID) for Al 157. Therefore, conventional Design A is unable to monitor with a Brookside tool or other tool controls.

In Design B, the flow signal (AI157) is pulled out and connected to a Phantom Mass Flow Controller (MFC): Air Flow Controllers (AFCs) 4 and 17. Here, AFC 4 is connected to SVID 2903, whereas AFC 17 is connected to SVID 2916. Therefore, the method and system of Design B is able to monitor backside pressure with the Brookside tool or other tool controls.

According to an embodiment as illustrated in Figure 2, the method and system of Design B creates a system disrupt to stop the CVD tool when the wafer to heater table contact is lost resulting in an increase in the backside gas flow...