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Measuring Flux Activity and Ionic Encapsulation Ability During Soldering

IP.com Disclosure Number: IPCOM000239499D
Publication Date: 2014-Nov-12
Document File: 1 page(s) / 42K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to perform real-time electrochemical measurements on the flux during the soldering process in order to determine the transition profile of the flux and the tendency to encapsulate the ionic species.

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Measuring Flux Activity and Ionic Encapsulation Ability During Soldering

If a flux is not taken through the proper temperature profile, the "uncooked" flux residue

will absorb moisture and cause corrosion and/or ion migration leading to eventual short-circuiting of closely spaced features on Printed Circuit Board Assemblies (PCBAs).

A convenient real-time technique is needed to determine the activity of the flux during the soldering operation and to determine the temperature profile necessary to fully encapsulate the ionic material so that the flux residue that remains on the PCBA will be chemically inactive and non-corrosive.

The novel contribution is a method to perform real-time electrochemical measurements on the flux to determine the chemical activity of the flux during the soldering operation and to determine the tendency of the post solder flux residue to encapsulate the ionic species and thereby become chemically inactive. The technique determines the ionic changes in the flux during and after the soldering operation.

During the soldering operation, the flux should be chemically active; after the soldering operation, the flux should be chemically inactive. The novel method measures the electrical conductivity of the flux during and after the soldering operation to characterize the chemical active behavior of the flux. This testing can characterize the ionic behavior of the flux and can contribute to the development and qualification of a flux.

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