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Method and Apparatus for Module Positioning and Diagnostics

IP.com Disclosure Number: IPCOM000239582D
Publication Date: 2014-Nov-17

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method in the area of memory subsystem for module positioning and diagnostics to ensure reliable operation.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 61% of the total text.

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Method and Apparatus for Module Positioning and Diagnostics

Hot module plug-in is an important feature in server system design to support new module insertion without disrupting mainline operation. Hot swap support allows to accommodate newer modules in case of upgrade or failure replacement without affecting server operation. Frequent insertion and removal of memory module affects the contact resistance adversely. This would result in improper connection affecting module operation and/or operate at degraded performance. Also, there is a problem with hot plug of memory modules and IO adapter cards (PCIE card, for example) where the pins could touch the active components and would lead to short circuit of signals. Another related issue is that a memory DIMM module sometimes stops working in a slot but works in another, due to either not making good contact (plugged in all the way) or some short happened on that socket. The idea here is:

A special guide and latch to direct and lock the module cards


Self-debug mechanism

An ohm meter like OR an onboard circuit that checks the connections via a decoder

o

that tells you which pins are not connected

Circuit is included within the cupping mechanism

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Separate molding would be recommended for different card types for better mating of

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test pins and card insertion


Useful for field upgrades or to replace faulty cards or systems manufacturing builds

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A sleeve over the pins that retracts only when it cups over the socket

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