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Method and System for Application of Modified Photomasks on Substrates with Non-planar Elements

IP.com Disclosure Number: IPCOM000239593D
Publication Date: 2014-Nov-18
Document File: 2 page(s) / 61K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and system is disclosed for application of modified photomasks on substrates with non-planar elements.

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This is the abbreviated version, containing approximately 63% of the total text.

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Method and System for Application of Modified Photomasks on Substrates with

Non-

-planar Elements

planar Elements

Contact photomasks need to make a good contact with the resist /substrates in order to give a good resolution. Wafers that are coated with resist have edge beads . Industries usually have a cleaning up process for removing the edge beads in order to maintain good contact of photomasks with substrates. However, there is still a need for a more efficient way to modify photomasks instead of processing substrates and removing edge beads.

Disclosed is a method and system for application of modified photomasks on substrates

with non-planar elements.

In an embodiment, the method includes masking a footprint with a hardmask and etching the area where the substrate protrudes. In case the photomask is made of quartz, the photomask can be etched using one of , but not limited to, reactive ion etching (using Tetrafluoromethane (CF4) chemistry) and a Hydrogen Fluoride (HF) based solution etching.

In one implementation, the method and system modifies the original structure and shape of photomask in accordance with the shape of substrate as illustrated in Fig . 1 and Fig. 2

Figure 1

Figure 2

The substrate or photoresist, which are continuously open to environment, can be exposed to one or more environmental elements such as , dust particles, and dirt. The one or more environmental elements can land on substrate and prevent intimate contact between the substrate/pho...