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Local Cooling of High Temperature Components by a Suspension of Phase Change Material

IP.com Disclosure Number: IPCOM000239650D
Publication Date: 2014-Nov-21
Document File: 1 page(s) / 7K

Publishing Venue

The IP.com Prior Art Database

Abstract

The proposed system is designed to cool individual electronics components by pumping a suspension consisting of particles of a phase change material and a carrier-fluid through a system of channels. Connected to these channels are electronics components that create high power losses and therefore require a good heat transfer or cooling. The particles of phase change material in the suspension will melt at the point of higher temperature, will absorb the heat and cool the electronics component. Further channels carry the mixture of carrier-fluid and molten phase change material into a storage container or into an active cooling system for regeneration.

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Title:

Local Cooling of High Temperature Components by a Suspension of Phase Change Material

Abstract:

The proposed system is designed to cool individual electronics components by pumping a suspension consisting of particles of a phase change material and a carrier-fluid through a system of channels. Connected to these channels are electronics components that create high power losses and therefore require a good heat transfer or cooling. The particles of phase change material in the suspension will melt at the point of higher temperature, will absorb the heat and cool the electronics component. Further channels carry the mixture of carrier- fluid and molten phase change material into a storage container or into an active cooling system for regeneration.

Description:

In downhole electronics we have general the problem that components which create high internal power-loss needs a good heat transfer to the outside of the tool to avoid overheating of those components. Packaging of downhole electronics in Q-pack or multi-chip modules prevent a good heat connection most of the time. Therefore a system is needed that can carry heat away from the hot- spots. The proposed system is designed to cool individual electronics components by pumping a suspension consisting of particles of a phase change material and a carrier-fluid through a system of channels. The suspension could consist for example of micro-particles of a tin-lead-alloy suspended in an oil- phase. Not only m...