Browse Prior Art Database

Integrated Circuit with Dummy Metal Fillers and Interconnect Routing and Method thereof

IP.com Disclosure Number: IPCOM000240092D
Publication Date: 2014-Dec-30
Document File: 4 page(s) / 165K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is an integrated circuit with dummy metal fillers and interconnect routing and a method for forming heat sinks by adding the dummy metal fillers and interconnect routing.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 55% of the total text.

Page 01 of 4

Integrated Circuit with Dummy Metal Fillers and Interconnect Routing and Method thereof

In general, Integrated Circuits (ICs) generate a lot of heat due to transistor activity and Joule heating of wires. Also, inter-metal dielectric and intra-metal dielectric used in ICs are generally made of silicon dioxide, which is a poor thermal conductor. This results in building up of heat within the IC, which affects the reliability of wires and functionality of devices.

Disclosed is an IC with dummy metal fillers and interconnect routing and a method for forming heat sinks by adding the dummy metal fillers and interconnect routing. Here, the dummy metal fillers are added to create heat distribution channels, which can be connected to internal or external heat sinks. The dummy metal filler structures can be added in empty regions without functional routes and empty circuit rows. The empty routing channels can then be used to connect the dummy metal filler structures to internal / external heat sinks through dummy routes.

Fig. 1 illustrates a cross section of a routed design that has empty routing spaces.

Figure 1

Fig. 2 illustrates a cross section of routed design with dummy metal fillers connected to external heat sinks via interconnect routes.

1


Page 02 of 4

Figure 2

The dummy metal fillers can also be connected to one or more local heat sinks as illustrated in Fig. 3.

Figure 3

Fig. 4 illustrates an exemplary method of forming the heat sink.

2


Page 03 of 4

Figure 4

As i...