Browse Prior Art Database

Semiconductor devices with high reliability

IP.com Disclosure Number: IPCOM000240273D
Publication Date: 2015-Jan-20
Document File: 3 page(s) / 96K

Publishing Venue

The IP.com Prior Art Database

Related People

Munaf Rahimo: AUTHOR [+4]

Abstract

The semiconductor device consists of the application of an insulating frame on the termination area of a semiconductor chip covering the passivation stripes which take the whole blocking voltage. This frame works as a protection against handling issues (e.g. tool scratches, particles deposition, etc.) by providing a mechanical protection and as reinforcement of the long-term blocking capability of the termination that might be deteriorated, for instance by humidity or particles. Since this frame is part of the fabrication process in the cleanroom, resource - consuming measures regarding handling and cleanliness can be reduced for subsequent process steps. At the same time, the frame works as a containment for the polyimide liquid with low viscosity, which is typically applied on the chip after the wire bonding process. The polyimide avoids the reconstruction of the aluminum on the active area during power cycling and therefore extensively increases the load cycling capability of the bonding wires. As a further benefit, the insulating frame works as a stopper against the uncontrolled spread of the polyimide liquid on the termination area.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 51% of the total text.

Page 01 of 3

1 / 3

Semiconductor devices with high reliability

Authors: M. Bayer, G. Pâques, Ch. Papadopoulus, M. Rahimo

TECHNICAL FIELD

The present disclosure in general relates to semiconductors, and specifically to high voltage semiconductor devices.

BACKGROUND OF THE DISCLOSURE

Experimental and application-related experiences with high voltage semiconductors show the requirement of solutions regarding the avoidance of particles, handling issues and the impact of humidity and other influence factors disturbing the high voltage isolation capability and overall reliability of these devices.

The usage of polyimide spread over the active area and the bond feet of the wire bonds is significantly improving the load cycling capability of the device. On the other hand, it should be avoided to let this low viscosity- polyimide flow over the termination area of the chips. The reason is the higher probability of defect spots due to particles along the edge of the polyimide. Nevertheless, a protective layer on the termination against external impact factors as particles, humidity, etc., applied under clean conditions is highly recommended.

SUMMARY

According to the present disclosure, an insulating frame on the termination area of a semiconductor chip covering the passivation stripes is disclosed, which take the whole blocking voltage. This frame works as a protection against handling issues (e.g. tool scratches, particles deposition, etc.) by providing a mechanical protection and as reinforcement of the long-term blocking capability of the termination that might be deteriorated, for instance by humidity or particles. Since this frame is part of the fabrication process in the cleanroom, resource - consuming measures regarding handling and cleanliness can be reduced for subsequent process steps. At the same time, the frame works as a containment for the polyimide liquid with low viscosity, which is typically applied on the chip after the wire bonding process. The polyimide avoids the reconstruction of the aluminum on the active area during power cycling and therefore extensively increases the load cycling capability of the bonding wires. As a further benefit, the insulating frame works as a stopper against the uncontrolled spread of the polyimide liquid on the termination area.

DETAILED DESCRIPTION OF EMBODIMENTS

In the following, an exemplary embodiment of a semiconductor device is described.

The frame, see fig. 1, can be applied in a cleanroom area for instance by screen-printing methods or dispense tools on the chip surface covering the mentioned area between chip edge and active area. It can consist of an adequate insul...