Browse Prior Art Database

On Chip Local Device Heating for Temperature Dependent Device Parameter Measurements

IP.com Disclosure Number: IPCOM000240364D
Publication Date: 2015-Jan-27
Document File: 2 page(s) / 37K

Publishing Venue

The IP.com Prior Art Database

Abstract

Ensuring high accuracy parameters on analog circuits is a common challenge in the semiconductor industry. The widely used approach is trimming the circuit parameters at two different temperatures. For this calibration temperature is applied from external requiring two different test insertions. This publication is proposing to use internal heating circuits to apply the temperature to the component under test locally so that the additional test insertion necessary for the trimming can be eliminated

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 71% of the total text.

On Chip Local Device Heating for Temperature Dependent Device Parameter Measurements

Abstract

Ensuring high accuracy parameters on analog circuits is a common challenge in the semiconductor industry. The widely used approach is trimming the circuit parameters at two different temperatures. For this calibration temperature is applied from external requiring two different test insertions.

This publication is proposing to use internal heating circuits to apply the temperature to the component under test locally so that the additional test insertion necessary for the trimming can be eliminated. .

On Chip Local Device Heating

Single/local device heating on a chip can be done with a small heater structure. For heating the joule heating of resistive elements can used which allows a cost effective implementation on chips. Due to the locality no regulation is necessary. The wafer/die thickness is large enough so that the thermal capacitance acts as a heat sink allowing for temperature saturation of the device under test (dut). With temp sensors in the structure like diodes it is possible to get the relative temperature increase due to the heating.

It can be integrated several times on a chip for different device heating possibilities. If the same test structure with heating is placed several times the tc variance on a chip can be measured

 (Figure 1)

Figure 1 Principle structure of the proposed components

The components are a switch to enable the heating element, the heating element...