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Method of performing Optical Proximity Correction using resist height Information

IP.com Disclosure Number: IPCOM000240550D
Publication Date: 2015-Feb-09
Document File: 2 page(s) / 79K

Publishing Venue

The IP.com Prior Art Database

Abstract

Post-Etch or Post-CMP shorting failure because of resist top loss not being predicted by 2D Model, which is based on bottom CD.

3D Models can predict top-loss. But, they are not suited for full-chip OPC or ORC. § Building regression model to predict resist height based on aerial image parameter extractions from 2D model and top-loss information from 3D model, and applying it to perform OPC by incorporating resist height as one of the cost function in addition to regular ΔCD

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Method of performing Optical Proximity Correction using resist height Information Problem
Post-Etch or Post-CMP shorting failure because of resist top loss not being predicted by 2D Model, which is based on bottom CD.
3D Models can predict top-loss. But, they are not suited for full-chip OPC or ORC. Proposed Solution

Aerial image parameters

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What is novel about it ?
Building regression model to predict resist height based on aerial image parameter extractions from 2D model and top-loss information from 3D model.

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