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CONFIGURATIONS OF WHILE-DRILLING TOOLS AND SYSTEMS

IP.com Disclosure Number: IPCOM000240749D
Publication Date: 2015-Feb-25
Document File: 4 page(s) / 461K

Publishing Venue

The IP.com Prior Art Database

Related People

Stephanie Chi: ATTORNEY

Abstract

A Parylene conformal coating may be deposited on electronic packaging including Titanium, Kovar, or combinations thereof. Furthermore, in some embodiments, the electronic packaging may include combinations of Titanium, Kovar, and Parylene. The Titanium/Kovar lids with Parylene coating may result in a reduced package size to improve integration of high voltage electronics. Furthermore, temperature sensor may be micro-packaged in the same enclosure as a crystal oscillator. The temperature sensor will provide an accurate crystal temperature, and this information may be used to compute the crystal frequency versus its temperature and compensate its nominal value.

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CONFIGURATIONS OF WHILE-DRILLING TOOLS AND SYSTEMS

When drilling holes in subsurface formations it may be necessary to utilize, usually as part of the bottom hole assembly, a downhole unit having one or more formation-engaging members which may be extended or retracted relative to the main body of the unit for engagement and disengagement with the wall of the borehole.  Techniques relate to a drilling system or apparatus suitable for operating in high temperature or high pressure environments, such as downhole environments.  In particular, techniques relate to packaging, configurations, and operations of temperature-sensitive devices, such as electronics or reference clocks, to increase the temperature range in which downhole units may operate in downhole environments.

In current drilling systems or apparatuses, electronic systems may be packaged to protect them from high temperature environments.  However, some current packaging techniques may have limitations.  For example, in current packaging configurations, temperature-sensitive electronics may be separated by a minimum distance between active areas (e.g., from a top of the electronics to the lids), and this loss of place may limit the size efficiency of the electronics.  Furthermore, coatings disposed inside cavities containing electronics may limit the reliability of the boards.  For example, a CTE mismatch between the coating and wire bondings may result in outgassing of elements, which may impact the lifetime of the electronics. 

In accordance with some embodiments of the present disclosure, a Parylene conformal coating may be deposited on electronic packaging including Titanium, Kovar, or combinations thereof.  Furthermore, in some embodiments, the electronic packaging may include combinations of Titanium, Kovar, and Parylene.  The Titanium/Kovar lids with Parylene coating may result in a reduced package size to improve integration of high voltage electronics.  Accordingly, tools or devices having electronics packaged in such configurations may be used over an increased range of operating temperatures and in more extreme mission profiles, including high voltage applications (e.g., voltages above 500V).

Different types of packaging may be used at the board level, the PWA, and/or for multichip modules.  For example, multichip modules may have a hermetically sealed ceramic area containing microelectronics (e.g., in a hermetic cavity).  Additionally, metallic housing may be available for a hermetic sealing using soldered lid closures, seam welding, laser welding, or combinations thereof. 

For example, as shown in FIG. 1, the conformal coating of Parylene may insulate the packaging and protect the packaging itself, as well as the electronics inside. 

Furthermore, drilling systems or apparatuses may include crystal oscillators suitable for providing timing for the downhole units.  The crystal oscillators may be compensated to reduce their sensitivity to temperature.  For e...