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Pogo Pin with Hollow Plunger

IP.com Disclosure Number: IPCOM000241663D
Publication Date: 2015-May-20
Document File: 2 page(s) / 909K

Publishing Venue

The IP.com Prior Art Database

Abstract

Socket Pogo Pin (spring pin) is an essential component of connecting DUT leads and tester channels during the whole test processing. It plays the most important role of DUT leads contact quality that directly impacts electrical testing parameter result (yield, site performance & retest rate) of final test mass production. Currently, scraps melted from device leads during the very high temperature, like 145℃, especially for BGA materials. This scraps would accumulated on pogo pin plungers and impact the electric property performance on test result. In this paper we present a pogo pin with a hollow plungers that provides an opportunity to fix the stage current standing. Abbreviation: DUT – Device under test, CT – Cold Test HT – Hot Test, GND – Ground, FT – Final Test.

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Pogo Pin with Hollow Plunger


AbstractSocket Pogo Pin (spring pin) is an essential component of connecting DUT leads and tester channels during the whole test processing. It plays the most important role of DUT leads contact quality that directly impacts electrical testing parameter result (yield, site performance & retest rate) of final test mass production.

Currently, scraps melted from device leads during the very high temperature, like 145, especially for BGA materials. This scraps would accumulated on pogo pin plungers and impact the electric property performance on test result.  In this paper we present a pogo pin with a hollow plungers that provides an opportunity to fix the stage current standing.

Abbreviation: DUT – Device under test, CT – Cold Test HT – Hot Test, GND – Ground, FT – Final Test.

1. Background

S

ocket pin plunger A provides the contact interface to test device, and the plunger B is for load board conductive pad, Fig. [1].

Fig. [1] Pogo pin role in final test

Currently, a mass of BGA package devices settled a hot temperature test on J750 platform and seen serious site to site yield variation issue caused by functional tests at hot temperature. Site issue at HT causes ~4.7% retest rate loss, site performance around 56.7% loss, and 0.07% J750 OEE loss.

These kinds of BGA material need a hot test in a very high temperate(like 145℃), and after thousands contacting to devices under such a high temp, scraps would melt from BGA balls, Fig. [2].

Fig. [2] Scraps accumulated on pogo pin plungers.

Scraps were melted from BGA balls after thousands contacting during the hot temperature test. Conductive scraps would impact the electric-property variation of pogo pins, like electrical resistivity and then impact the performance.

2. Technical Barriers

1] The melt couldn’t be avoided because of the high temperature test condition can’t be changed.

2] The plunger A of pogo pin has a so small size that have no chance to clean these scraps up, which without damage the plungers.

3. Solution

A pogo pin with a hollow plunger that provides a minimum contact area to the DUTs, and then the scraps melted from BGA balls attached to pogo pin plunger would be certainly reduced.

In a condition of can’t refrain device balls from melting scraps, the solution aimed to move scraps accumulated from pogo pin plunger to pogo pin bar...