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Method to Create and Release Very Thin Components Based on a Double Flip Wafer Dicing Process

IP.com Disclosure Number: IPCOM000241728D
Publication Date: 2015-May-26
Document File: 4 page(s) / 138K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a process which incorporates a series of partial dice and wafer transport operations to allow an individual die to fully separate from a wafer while remaining protected. This protection is on a dicing tape/frame for picking at placement or is by complete removal from the dicing tape for placement into a chip carrier for direct pick at placement.

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Method to Create and Release Very Thin Components Based on a Double Flip Wafer Dicing Process

Very thin electronics devices, such as die and interposers (IP), are difficult to handle and transport in preparation for joining to carriers or other devices. Devices in the 20-100um thickness range challenge dicing tape separation and storage/transport. The larger devices are usually processed while mounted on temporary carriers, for instance on glass carriers, bonded with an adhesive. Thereafter, they are diced while still bonded to the carrier or, are diced after first removing the thin fragile wafer from the carrier, and remounting it on a dicing tape frame assembly. These processes are expensive and complicate the release process to remove the devices from a temporary carrier.

There are many processes for handling thin wafers containing interposers and die. Most are not on carriers. Thicker interposers would simplify subsequent bonding to carriers and reduce assembly costs; however, a method is still needed to handle thin die and interposer wafers thru layers processing, often on both sides of the wafer while attached to a carrier.

Thus, a method is needed to dice devices from a substrate/wafer and either completely separate the devices or use a low retaining force to maintain these on a dicing tape frame.

The novel contribution is a process to enable that capability. The process incorporates a series of partial dice and wafer transport operations to allow the individual die to be fully separated from a wafer with minimal handling. This protection is provided by either keeping the separated devices on a dicing tape frame for picking during the placement process or by completely removing the die from the dicing tape for placement into a chip holder or waffle pack for direct pick during the placement proces...