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A method for determining maximum temperature exposure of a chip or chip module

IP.com Disclosure Number: IPCOM000241955D
Publication Date: 2015-Jun-10
Document File: 2 page(s) / 139K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to determine the maximum temperature exposure for a microchip or package using microfabricated test structures.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 95% of the total text.

Page 01 of 2

A method for determining maximum temperature exposure of a chip or chip module Current chip/package temperature sensors are not necessarily localized and might require calibration.

A method is needed to determine maximum temperature exposure.

The novel contribution is a method to determine the maximum temperature exposure for a microchip or package using microfabricated test structures. Solder based fuses are fabricated on the chip or package. The composition of the fuses is tuned to melt at a specific melting temperature.

The fuse-based temperature sensor comprises:


 Operative Physical Phenomena


- Wetting/Dewetting: Generally, metals wet clean metal and dewet oxides

      - Phase Transitions: Melting
 Electrical Readout: Complete Circuit (current ≠ 0) or Broken circuit (current = 0)  Value: Additional Real-time Data for System Diagnostics
Figure 1: Fuse-based temperature sensor

The size of the sensor is 100µm(max) 1µm(min) and it has two to three lithography levels. It uses Rapid System Diagnostics and is amenable to array type circuit designs and multiplexing (i.e. digital displays). The sensor can be fabricated directly on the chip or package after the higher temperature processes or transferred to the chip or package from a handler.

Figure 2: Layout

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An electrical readout indicates which circuits are intact and which are broken, thus revealing the maximum temperature exposure. A broken circuit indicates that the fuse is blown via a tempera...