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MODULAR ATTACHMENT FOR WIRES/PULSERS TO CERAMIC CRYSTALS

IP.com Disclosure Number: IPCOM000242094D
Publication Date: 2015-Jun-18
Document File: 4 page(s) / 65K

Publishing Venue

The IP.com Prior Art Database

Abstract

ABSTRACT A modular design for electrical connections of ultrasound phase array probe is disclosed. The disclosure includes two techniques to achieve such modular design of electrical connections. In the first technique, a mold fixture is used to install a set number of pins, e.g. 16, into a module. Then a backing is poured around the pins to encapsulate them with an extension of the pin exposed in order to press against a ceramic and a back of the pin exposed in order to allow attachment of the module. The backing mold is modularized based on the set number of pins in order to design attachment boards based on a number of element modules which may be a multiple of the set number of pins. In the second technique, a minimal pitch requirement is determined. Then, a maximum length array is made using the minimal pitch. Subsequently, the module is cut to a length required for the modular design and a printed circuit board (PCB) is attached to the pins, where, the PCB connects to the pins associated with the required pitch.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 50% of the total text.

Page 01 of 4

268882

MODULAR ATTACHMENT FOR WIRES/PULSERS TO CERAMIC CRYSTALS

BACKGROUND

The present disclosure relates generally to a phased array probe and more particularly to a modular attachment for wire or pulsers to ceramic crystals constituting the phased array probe.

Generally, phased array ultrasound is used to provide an advanced means of non-destructive testing for materials used in various industries. A phased array ultrasonic device includes phased array probes, which are made of a large number of simple probes organized in different array arrangements, such as, a linear array and a circular array, among others. The phased array probes are generally made of piezoelectric ceramic crystals.

Electrical connections of the phased array probe are usually obtained by hand wiring. However, process of hand wiring of the phased array probe is time consuming. Also, hand wiring can cause damage to the ceramic plating due to heating of the ceramic with a solder. Lamination method may also be used to obtain electrical connections of the phased array probe. The lamination method, however, requires precise machined parts which reduces flexibility. There are other conventional techniques known in the art that provide alternative methods for providing electrical connections of the ultrasound phased array probes. For example, in a conventional technique, transducer elements are electrically connected to pulsers via through-holes in an acoustic backing layer. Another conventional technique includes a cable direct interconnection (CDI) method for phased array transducers.

However, the above described conventional techniques do not provide a phase array probe design that can be used for multiple length arrays using a single pitch.

It would be desirable to have a technique that provides electrical connections of ultrasound phased array probes such that the probe design can be used for multiple length arrays using a single pitch.


Page 02 of 4

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BRIEF DESCRIPTION OF DRAWINGS

Figure 1 depicts a module design with an array of 16 elements having 2 mm pitch.

Figure 2 depicts a module design with an array of 16 elements having 4 mm pitch.

DETAILED DESCRIPTION

A modular design for electrical connections of ultrasound phase array probe is disclosed. The disclosure describes two techniques to achieve such modular design of electrical connections.

In a first exemplary technique, a mold fixture is used to install a set number of 16 pins, although other numbers of pins are also contemplated (e.g. 3, 4, 8, 9, 25, 32, 36, 64, etc.), into a module. Then a backing is poured around the pins to encapsulate them with an extension of the pin exposed in order to press against a ceramic and a back of the pin exposed in order to allow attachment of the module. The backing mold is modularized based on the set number of pins to design attachment boards based on the set number of element modules. Further, each probe is designed as a multiple of the set number, (e.g. 3, 4, 8...