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LIQUID COOLED TOROID HEAT SINK MANIFOLD SYSTEM

IP.com Disclosure Number: IPCOM000242294D
Publication Date: 2015-Jul-03
Document File: 4 page(s) / 127K

Publishing Venue

The IP.com Prior Art Database

Abstract

This disclosure provides a heat sink manifold system. The heat sink manifold system includes a first cavity and a second cavity. The first cavity is known as a dry cavity. The first cavity is composed of multiple slotted openings. Each of the slotted openings houses a single toroid. Each toroid is surrounded by an electrically isolated, thermally conductive material coupled to the metal surface of the first cavity. The second cavity is known as a wet cavity. The second cavity is machined on an underside of the dry cavity. Such arrangement of the two cavities permits a liquid coolant to flow from one end of a manifold to the other end of the manifold without making direct contact with the toroid or an electrical conductor. The liquid coolant flows through the under portion of the dry cavity and absorbs any excess heat generated from magnetic core of the toroid.

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LIQUID COOLED TOROID HEAT SINK MANIFOLD SYSTEM

BACKGROUND

The present disclosure relates generally to heat sinks, and more particularly to a liquid cooled toroid heat sink manifold system.

Thermal management of semiconductor devices is a major challenge.  Performance of semiconductor devices degrades at high temperatures.  Various conventional techniques use natural convection and forced air convection for cooling the semiconductor devices.  However, natural convection and the forced air convection offer inadequate cooling for high performance circuits.

Conventional techniques are unable to provide adequate cooling for the toroids due to which their magnetic properties deteriorate.  If toriods exceed their Curie temperature rating, magnetic properties of toroids deteriorate dramatically and performance is dimensioned as a saturable snubbing device. This is further detrimental to switch mode power supplies and power electronics using toroids.    

It would be desirable to have an improved cooling technique for toroid heat sinks.

BRIEF DESCRIPTION OF DRAWINGS

Figure 1 depicts a heat-sink manifold system according to an embodiment of the present invention.

Figure 2 depicts thermal results of the heat sink manifold system according to an embodiment of the present invention.  

DETAILED DESCRIPTION

This disclosure provides a heat sink manifold system for improving operating characteristics of saturable magnetic cores. 

Figure 1 depicts the heat-sink manifold system according to an embodiment of the present invention.  The heat sink manifold system includes two cavities, a first cavity and a second cavity.  The first cavity is also known as a dry cavity.  The first cavity is composed of multiple slotted openings.  Each of the slotted openings houses a single toroid.  Each toroid is surrounded by an electrically isolated, thermally conductive material coupled with the metal surface of the first cavity.

The second cavity is known as a wet cavity.  The second cavity is machined on an underside of t...