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Stack Package on Universal Substrate

IP.com Disclosure Number: IPCOM000242811D
Publication Date: 2015-Aug-19
Document File: 3 page(s) / 116K

Publishing Venue

The IP.com Prior Art Database

Abstract

Stack packaging is becoming more common in the industry. Package on package and package with multiple dies stacked vertically are frequently available as a solution to increase the package IO and functionality. In the semiconductor industry, it has also become more competitive in introducing newer and more advanced IC packages. There is a need to stay competitive and provide value added solutions to our customers to keep pace with the advances in technology.

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TITLE

Stack Package on Universal Substrate

ABSTRACT

Stack packaging is becoming more common in the industry.  Package on package and package with multiple dies stacked vertically are frequently available as a solution to increase the package IO and functionality. In the semiconductor industry, it has also become more competitive in introducing newer and more advanced IC packages. There is a need to stay competitive and provide value added solutions to our customers to keep pace with the advances in technology.

CONTENT

Vertical wire bonding is a new process that has not yet been widely adopted in the semiconductor industry.  In this process, vertical wires are coupled with anisotropic conductive paste (ACP) to form a unique interconnection between a die and a substrate.

The differences between this process and the conventional known die to substrate connection processes are:

1.       The mold package is stacked on a universal substrate with vertical wires. The universal substrate is a 1 layer, thin substrate with through via directly connecting from the top pad to the bottom pad.

2.       Array interconnection with the vertical wires from the daughter package to the universal substrate.

3.       Interconnection of the vertical wires to the substrate with ACP.

Multiple package variants can be derived with this technology or method of packaging, as shown in figure 1.

Figure 1 Different methods of interconnection with vertical wire and ACP technology.

This process uses low cost material. Copper...