Browse Prior Art Database

Wire Bonder Traceability Control Method

IP.com Disclosure Number: IPCOM000243121D
Publication Date: 2015-Sep-16
Document File: 2 page(s) / 276K

Publishing Venue

The IP.com Prior Art Database

Abstract

The idea here is to assign a certain wire bond location pattern for 2nd bond to indicate a specific Wire Bonder either at 1 side of the package or binary coding to indicate Wire Bonder #.

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Document Title 

Wire Bonder Traceability Control Method

   

Abstract 

The idea here is to assign a certain wire bond location pattern for 2nd bond to indicate a specific Wire Bonder either at 1 side of the package or binary coding to indicate Wire Bonder #.

Body 

Nowadays in Semiconductors manufacturing, it’s a standard practice for 1 assembly lot to be assembled from more than 1 wire bonder (WB) equipment for better cycle time control. However, the main concern is once the wire bond sub-lots are combined before the molding process, there is no possibility to trace back any abnormality at Testing or even Customer side except  to consider all WB equipment are affected for further investigation. Even after finding the affected WB equipment, it’s not possible to screen out all the units from the affected equipment but to contain/scrap the whole lot. By assigning a certain pattern in 2nd bond location with below 2 methodologies, the singulation units are able to trace back to actual Wire Bonder that bonded that particular unit.

Drawings

Fig 1: General Process flow, where multiple Wire bonder is used for 1 assy lot as below:-         

Fig 2 To identify Wire Bonder (1st Methodology)

Fig 3: Binary Coding (2nd methodology)