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Method for Passing a Flowline along a Downhole Tool Equipped with Dewar Flasks

IP.com Disclosure Number: IPCOM000243190D
Publication Date: 2015-Sep-17

Publishing Venue

The IP.com Prior Art Database

Related People

Stephanie Chi: ATTORNEY

Abstract

In some downhole tools typically used for pumping, in-situ analysis, or sampling purposes, flowlines are needed to transport fluids internally. These flowlines may run along the tool and may be a good medium to transport heat through the fluid in high temperature application. Due to space constraints, they are often routed near electronic boards, or other temperature sensitive equipment, and may even be incorporated in electronic chassis. Embodiments involve different designs for passing a flowline through a downhole tool having a flask housing.

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Method for Passing a Flowline along a Downhole Tool Equipped with Dewar Flasks

In some downhole tools typically used for pumping, in-situ analysis, or sampling purposes, flowlines are needed to transport fluids internally. These flowlines may run along the tool and may be a good medium to transport heat through the fluid in high temperature application. The fluids are typically at a pressure close to the hydrostatic pressure, and can drop or increase by +/- 50% over smaller periods of time.  Due to space constraints, they are often routed near electronic boards, or other temperature sensitive equipment, and may even be incorporated in electronic chassis.

Downhole tools may have electronic cartridges or other equipment that are not resistant to temperature, in which case they can be protected against heat by the usage of Dewar flask.  They may further be protected against hydrostatic pressure by the usage of pressure housings.

This may lead to incompatibility in the system design, as flask is a heat insulator and a flowline can carry thousands of thermal watts.  One or more embodiments of the present techniques address these issues where space is a constraint (e.g., typically downhole tool application), or where a sensor is placed close to its associated electronics.  One or more embodiments also involve optimizing a design for fixed temperature-sensitive hardware dimensions, a fixed flowline ID, a fixed max hydrostatic pressure value, and a minimal hardware modification in the case of minimized sensor to temperature sensitive equipment distance.

            In one embodiment, no interaction is required between the flowline fluid and the temperature sensitive hardware, and as a result, the design may involve a flasked pressure housing that enables the passage of a flowline.  This embodiment may be represented in FIG. 1.  In such embodiments, the functionalities (heat insulation and pressure resistance) that are commonly linked in a standard flask design may be separated. Different design options may be used for the same temperature sensitive hardware dimensions. 

In another embodiment, an interaction may be required between the flowline fluid and the temperature sensitive hardware, and as a result, the flowline design may be inside a flasked housing to incorporate a flowline fluid sensor, while minimizing the distance between the sensor to an associated temperature sensitive hardware.  This embodiment may be represented in FIG. 2.

A first design option for embodiments where no interaction is required between the flowline fluid and the temperature sensitive hardware (as in FIG. 1), may be represented in FIG. 3, where the flowline and flasked housing may run inside a pressure housing, such that the 3 elements are separated.  The design may have a minimum diameter limitation, due to the fact that the flask insulation uses an outer skin (e.g., the pressure housing in a standard dewar flask design), and that the flowline has to...