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A Method for Embedding Series of Capacitor Structures on a Single Plane

IP.com Disclosure Number: IPCOM000243581D
Publication Date: 2015-Oct-02
Document File: 2 page(s) / 51K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for embedding a series of capacitor structures on a single plane of a circuit board. The method is also used to break a single structure into multiple serial connections for reducing voltage across plates or filaments in the circuit.

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A Method for Embedding Series of Capacitor Structures on a Single Plane

Disclosed is a method for embedding a series of capacitor structures on a single plane of a circuit board. The method is also used to break a single structure into multiple serial connections for reducing voltage across plates or filaments in the circuit. Our method allows the possibilities for use in additive manufacturing fabrication (ie. 3D printing).

The method of embedding the series of capacitor structures on a single plane is formed by connecting two capacitor structures in series by connecting a positive electrode filament of one capacitor structure with a negative electrode filament of other capacitor structure. Further, the method of connecting the positive electrode filament to the negative electrode filament can also be used for connecting two capacitor structures in parallel on the single plane. The proposed method is well suited for fabrication in an additive manufacturing process as well as previously described processes such as photo-etch technology.

In addition, the negative and positive filaments of the capacitor structures can be embedded in an alternative fashion as illustrated in the Figure below.

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Figure

Here, the top half of the structure is considered as one capacitor and second half of the structure is considered as a second capacitor. The process of embedding series capacitors can be repeated for adding multiple capacitors in series or parallel on the...