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Stacked Package System with Flexible Substrate Interposer Having Slits Allowing Folding for Package Stacking

IP.com Disclosure Number: IPCOM000243649D
Publication Date: 2015-Oct-07
Document File: 4 page(s) / 185K

Publishing Venue

The IP.com Prior Art Database

Abstract

System integration of microelectronic components involves the electrical interconnection of multiple system components such as microprocessors memory power management wireless and sensors As the number of components increases the microelectronic assembly grows in size and makes miniaturization more difficult Portable and wearable devices are ever increasing in component density while requiring volume efficiency so rely on packaging technologies such as 3D stacking to accomplish these goals The multiple system components can be assembled as separate packages but then need a means of interconnection between the separate packages in a manner that provides volume efficiency while being manufacturable and testable A flexible substrate flex having slits is used as the means of interconnection while allowing folding of the assembly to provide volume efficient stacking of the packages

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Stacked Package System with Flexible Substrate Interposer Having Slits Allowing Folding for Package Stacking

Abstract

System integration of microelectronic components involves the electrical interconnection of multiple system components such as microprocessors, memory, power management, wireless, and sensors. As the number of components increases, the microelectronic assembly grows in size and makes miniaturization more difficult. Portable and wearable devices are ever increasing in component density while requiring volume efficiency, so rely on packaging technologies such as 3D stacking to accomplish these goals. The multiple system components can be assembled as separate packages, but then need a means of interconnection between the separate packages in a manner that provides volume efficiency while being manufacturable and testable. A flexible substrate (flex) having slits is used as the means of interconnection while allowing folding of the assembly to provide volume efficient stacking of the packages.

The formation of a folded rigid flex assembly in a manner that is manufacturable and testable is accomplished by use of slits (see Fig. 1) in the flex. Multiple packages are assembled on the same side of the flex (Fig. 1) for ease of assembly and then the assembly is tested at the test pads on the same side as the assembled modules. Solder balls are attached to the opposite side of the flex to form interconnects for assembly to a printed circuit board (PCB) in subsequent processes. Slits are made in the flex (see Fig. 1) allowing folding of the flex and stacking of the assembled packages to provide reduction in PCB footprint and volumetric shrink as well as shortened trace lengths between packages for improved performance. Key to the folding are the slits in the flex that...