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All Polymer Substrate Ball Grid Package

IP.com Disclosure Number: IPCOM000243650D
Publication Date: 2015-Oct-07
Document File: 2 page(s) / 65K

Publishing Venue

The IP.com Prior Art Database

Abstract

Conventional laminate substrate with redistribution layer RDL and dielectric material layer has significant reliability concern due to metal organic material interfaces RDL must be covered by organic layers to avoid exposure to atmosphere to prevent corrosion For coreless substrates unbalanced layer stack can result in warpage issue for semiconductor package

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TITLE

All Polymer Substrate Ball Grid Package

Conventional laminate substrate with redistribution layer (RDL) and dielectric material layer has significant reliability concern due to metal-organic material interfaces. RDL must be covered by organic layers to avoid exposure to atmosphere to prevent corrosion. For coreless substrates, unbalanced layer stack can result in warpage issue for semiconductor package.

All polymeric substrate is proposed with conductive polymer (e.g. polyacetylene) as RDL layer and non-conductive polymers (e.g. polyimide, polybenzoxazole, etc.) as the dielectric layer. Conductive polymer traces can be achieved by printing or photo-imaging process. Conductive polymer layer should provide strong polymer (conductive) to polymer (dielectric, non-conductive). Oxidation by exposure to atmospheric conditions can be significantly minimized. Figure 1 is schematic with conductive polymer as the electrical connection route. Nonconductive polymer acts as standard dielectric material. Figure 2 shows the process for to achieve the all polymeric substrate structure based semiconductor package.

 

Figure 1: Ball Grid Array (BGA) package with all polymeric substrate.

Figure 2: Process flow for All Polymeric Substrate Ball Grid Array package