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Modular Heat Sink Fin Design

IP.com Disclosure Number: IPCOM000244112D
Publication Date: 2015-Nov-09
Document File: 3 page(s) / 86K

Publishing Venue

The IP.com Prior Art Database

Abstract

Described is a method that allows the building of custom heat sink shapes and sizes, depending on what form factor is needed, with minimal development work and time.

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This is the abbreviated version, containing approximately 78% of the total text.

Page 01 of 3

Modular Heat Sink Fin Design

Currently, heat sinks must be sized according to the dimensions available to them on a per-system basis. In other words, each different system may require its own heat sink in order to make maximum use of the space available.

This proposed solution allows custom-sized heat sinks with relatively little effort or development time required. It is less efficient than a custom-designed solution, but its flexibility enables servers to use all available heat sink area, when ordinarily they might need to make do with smaller heat sinks due to time or cost constraints during development.

    This invention makes the fins and heat pipes modular, rather than fully integrated. Each fin has a cutout with a flange inside and three solder beads added. The fins are press-fit onto the heat pipes when the heat sink is put together; the solder beads' softness will aid this process by deforming to make way for the heat pipe. Fins are attached in such a way as to mimic the structure of a more traditionally-assembled heat sink. The middle fins are first attached to the heat pipes by press-fitting them, as shown in Figure 1:

Figure 1

    
The initial press-fit is achieved by solder beads inside flanges of the heat pipes pressing onto the heat pipe (see Figure 2). A hot plate may be applied to the heat pipes or fins to melt the solder, create good thermal conductivity, and make the attachment permanent.

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Page 02 of 3

Figure 2

    
An outside fin structure may be added b...