Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method for Attaching and Improving Thermal Contact of Pad Materials

IP.com Disclosure Number: IPCOM000244136D
Publication Date: 2015-Nov-12
Document File: 2 page(s) / 36K

Publishing Venue

The IP.com Prior Art Database

Abstract

Described is a method to attach pad thermal interface materials to a heat sink or lidded module by use of a setae-like fiber structure incorporated into the surface of the pad. These structures use directional adhesion that allows for a non-viscous attachment that improves heat transfer and function of the thermal interface.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 57% of the total text.

Page 01 of 2

Method for Attaching and Improving Thermal Contact of Pad Materials

Pad materials are becoming more popular for use as thermal interfaces in electronics. Pads have benefit for field replacement and ease of manufacturing. However, the contact resistance of pad materials is often much higher than those of a grease or a gel. In addition, pad materials are typically unable to attach or bond to a heat sink surface, making any vertical assembly very difficult. Adding an adhesive to pads will almost always decrease the thermal performance enough to mitigate any benefit to using a pad at all. Disclosed here is a method for decreasing pad contact resistance while offering a non-viscous method of attach.

    The directional adhesion allows a non-viscous attachment method and also decreases thermal resistance. [1, 2] This can be done in two different methods and a new application. Embodiment I has the gecko setae attach via the perimeter. This allows for easy removal of the heat sink from the module or allows for high load applications. Embodiment II has gecko setae across the entire pad and can be placed on both the top and bottom of the pad. This allows for attachment of a non-load attach heat sink. Embodiment III is an alternative method for encapsulating a die.

Embodiment I: The directional adhesion is placed around the perimeter to help attach the heat sink and TIM to the module (see Figure 1 below).

Figure 1

Embodiment II: Directional adhesion is applied across the entir...