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Thermally Enhanced BGA Package with High Density Substrate using Cavity less Molding

IP.com Disclosure Number: IPCOM000244175D
Publication Date: 2015-Nov-19
Document File: 3 page(s) / 386K

Publishing Venue

The IP.com Prior Art Database

Abstract

Minimal packaging cost imperative is pressuring the industry for the adoption of high density substrate in assembling BGA packages Conventional PBGA and MAPBGA substrates are being re designed into larger substrate panel sizes to accommodate over two times as many units as compared to conventional MAPBGA substrates While PBGA and MAPBGA may migrate seamlessly into the high density substrate design TePBGAII which use drop in heat spreaders present far greater design and process change challenges This paper provides a method to allow TePBGAII packages with drop in heat spreaders to adopt high density substrates

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Thermally Enhanced BGA Package with High Density Substrate using Cavity-less Molding

Abstract 

Minimal packaging cost imperative is pressuring the industry for the adoption of high density substrate in assembling BGA packages. Conventional PBGA and MAPBGA substrates are being re-designed into larger substrate panel sizes to accommodate over two times as many units as compared to conventional MAPBGA substrates.  While PBGA and MAPBGA may migrate seamlessly into the high density substrate design, TePBGAII, which use drop in heat spreaders, present far greater design and process change challenges. This paper provides a method to allow TePBGAII packages with drop in heat spreaders to adopt high density substrates.

Body 

The problem associated with assembling TePBGAII packages using high density substrates is due to the conventional transfer molding process incompatibility. Transfer molding of an array of heat spreaders has the following issues:  

1)     Execessive mold voids, meld lines, and incomplete fill resulting from large MAP mold flow path;

2)     High wire sweep due to larger flow path required to fill the large MAP mold cavity;

3)     Resin bleeding over spreader tops due to difficulty in maintaining heat spreader stand-off height

We propose using drop in heat spreaders to form the outline of the TePBGAII package.  Mold compound is channeled into the heat spreader to fill the space where the die and bond wires are encased by the heat spreader only.  Mold compound does not enc...