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Semiconductor Package Without Wire Bond Process

IP.com Disclosure Number: IPCOM000244835D
Publication Date: 2016-Jan-20
Document File: 2 page(s) / 51K

Publishing Venue

The IP.com Prior Art Database

Abstract

Wire touch and wire sweep are difficult issues faced during the manufacturing process. In this paper we present a package that has bond wires but does not use a traditional wire bonding process.

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Semiconductor Package Without Wire Bond Process

Abstract:

Wire touch and wire sweep are difficult issues faced during the manufacturing process. In this paper we present a package that has bond wires but does not use a traditional wire bonding process.

Body:

                There is a layer with insulative glue that covers the die surface to avoid any other conductor effect and protect the die.  A groove is formed on the insulative glue surface base on bonding diagram and layout will connect from first bond to second bond.  A conductive material is injected into the groove to form an electrical connection between a die bonding pad and a lead of a lead frame.  In this way, first and second bond areas are electrically connected. This method replaces the traditional wire bonding process.

   

                As mentioned, insulative glue covers the die surface to protect the die to avoid other conductor effect.  The groove locations can be programmed based on a wire bonding diagram.  With this process there is no wire touch issue because each groove is isolated by insulative glue.  There also is no wire sweep issue because the wires (conductive material) are located within a groove instead of looped.

Ø  Figure 1: An example of die and lead frame structure.

Ø  Figure 2: Design a layer with insulative glue cover die surface  so as to avoid any other

conductor effect and protect the die.

Ø  Figure 3:  Groove on the insulative glue surface ba...