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A Method of Partial Encapsulation with Conductive Material for Compartment EMI Shield

IP.com Disclosure Number: IPCOM000245016D
Publication Date: 2016-Feb-05
Document File: 3 page(s) / 923K

Publishing Venue

The IP.com Prior Art Database

Abstract

This paper is to explain the Compartment shield for Avago PA/PAD modules applying partial encapsulation with conductive material.

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This is the abbreviated version, containing approximately 52% of the total text.

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A Method of Partial Encapsulation with Conductive Material for Compartment EMI Shield

Avago PA/PAD module

Ah Ron Lee, Deog Soon Choi, Hyun Mo Ku

Packaging Team, R&D, Wireless Semiconductor Division, Avago Technologies

shield is still beginning stage and many ideas really needed for further progress just on time.


II. SOLUTION

  As shown above simple schematic diagram, desirable RF block area (Blue) for compartment EMI shield can have partial mold material which has same function as a EMC by dispensing process with some underfill or encapsulation material and the conductive material can cover the encapsulation surface and substrate GND pad like a conventional 'metal shield can concept' but its size can be very small form factor which 'metal shield can' not be achievable.


III. EMBODIMENTS

  Described structure, process and material wise for the embodiments.


A.Basic Structure

  After full assembly build on the PKG substrate, form the partial encapsulation by dispensing or film lamination with encapsulation material and then, apply the conductive material on surface of encapsulation so that it can have fully grounded structure like a 'traditional metal can structure' but micro level.

  Abstract - This paper is to explain the Compartment shield for Avago PA/PAD modules applying partial encapsulation with conductive material.

I. INTRODUCTION (BACKGROUND/PROBLEMS)

  Avago PA/PAD modules which can be referred as SIP (System in Package) module are getting complicated, more integrated with smaller form factor as market needs. Also Avago modules are getting the upper hand in this industry by providing good solution at the right time including market needs as described above. However having more chips on one smaller modules can cause electromagnetic interference issue. Conventionally, after board level module mounting (ex. Smart phone board assembly with many parts like Avago PA modules) , the phone maker usually applies a 'conductive metal can' to reduce the EMI radiation on some specific area but the trend of thinner requirement makes difficulties to apply the "metal can" due to space limitation. Instead, conformal shielding on each parts come to be currently major trend for EMI shield which is usually foamed; very thin conductive layer on module surface by PVD process. (ex. Sputtering) From 2016, Avago PA/PAD mo...