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Method to Align components in 3D stacked ICs

IP.com Disclosure Number: IPCOM000245352D
Publication Date: 2016-Mar-02
Document File: 4 page(s) / 179K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to align integrated circuit (IC) components in a three-dimensional (3D) environment.

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Page 01 of 4

Title

Method to Align components in 3D stacked ICs

Abstract

Disclosed is a method to align integrated circuit (IC) components in a three-dimensional (3D) environment.

Problem

Aligning components in three-dimensional (3D) stacked circuits is critical, for example in package-on-package. Misalignment of components leads to failure, deviation from expected functionality, and pessimism in optimization.

Figure 1: Illustration of the problem

Solution/Novel Contribution

The novel contribution is a method to align integrated circuit (IC) components (e.g., packages/dies) in a 3D environment.

The solution includes a structure and method of component (e.g., package/die) alignment in 3D stacked ICs, which comprises:

• Conducting alignment structure attached to upper component

• Conducting alignment pad with an alignment marker at the center attached on the bottom component


• Differential amplifier making contact with two ends of the alignment pad

• Decision making processing device at the output of the differential amplifier
• Alignment device controlled by the decision making processing device

The solution also includes a method to align components, which comprises:


• Making contact between alignment structure and alignment pad
• Determining a voltage differential between two ends

• Realigning the components if the voltage differential is not zero

Method/Process

The method is comprised of the following components and functions:

1. Alignment Device: mechanically moves the components in X, Y, Z direction to make contact between packages/dies aligned in a 3D stack configuration


Page 02 of 4

2. Alignment Structure: a dummy/functional structure on the bottom face of one of the packages, which needs to make contact with the alignment pad at a specific point

3. Alignment Marker: a specific point at the center of the alignment pad on the upper face of bottom package that defines the precise point of contact for the alignment structure such that the components are aligned

4. Alignment Pad: an electrically conducting pad on top of the laminate that serves as the landing pad f...