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Adding Resistors & Capacitors to a Typical Copper/Polymer Redistribution Process Using Laser Ablation

IP.com Disclosure Number: IPCOM000245416D
Publication Date: 2016-Mar-08
Document File: 3 page(s) / 45K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that enables the creation of resistor and capacitor devices with minimal impacts to both cost and yield. The novel feature is the selective placement of regions where the metal barrier layer, used to support electroplating, is left behind during the plan of record fabrication process used to create on-polymer conductive wiring.

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Adding Resistors & Capacitors to a Typical Copper/Polymer Redistribution Process Using Laser Ablation

This method provides a low-cost method for adding resistors to on-polymer conductive wiring levels using projection laser ablation. This technique has direct applications for semiconductor fabrication (e.g., wafer-level packaging fan-out applications), interposer fabrication (e.g., adding resistors to glass-based interposers with without the addition of specialized processing), on-polymer medical probes (e.g., wiring buildup layers fabricated on Kapton(TM) films), etc. In these applications, resistors are added with the inclusion of discrete off-the-shelf devices or the addition of sputtered and patterned films. These processes typically have undesirable cost and yield implications.

The proposed method enables the creation of resistor and capacitor devices with minimal impacts to both cost and yield. The novel feature is the selective placement of regions where the metal barrier layer, used to support electroplating, is left behind during the plan of record fabrication process used to create on-polymer conductive wiring. Depending on the processing being used to create on-polymer conductive wiring levels, this method enables the creation of these devices without the need for any additional tooling or supplies. Process of record barrier films used to support electroplating, in particular Tantalum Nitride (TaN), are excellent choices for resistor material. The underlying polymer film can be laser etched to modulate its thickness, allowing the on-polymer conductive wiring to be brought into close proximity with pads beneath the polymer film, allowing for the creation of capacitors.

As previously stated, using prior methodologies, resistors are added with the inclusion of discrete off-the-shelf devices or the addition of sputtered & patterned films. These processes typically have undesirable cost and yield...