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Optimization of Gas Flow in the High Flow Process

IP.com Disclosure Number: IPCOM000246340D
Publication Date: 2016-Jun-01
Document File: 1 page(s) / 83K

Publishing Venue

The IP.com Prior Art Database

Abstract

Problem: Process gas is supplied into RC via a shower plate and a buffer plate in PECVD. If the amount of process gas is increased, the uniformity of the film will be affected negatively.

Solution: Gap between the buffer plate and shower plate increases, resulting in improvement of the uniformity.

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Problem: Process gas is supplied into RC via a shower plate and a buffer plate in PECVD. If the amount of process gas is increased, the uniformity of the film will be affected negatively.

Solution: Gap between the buffer plate and shower plate increases, resulting in improvement of the uniformity.

Fig. 1 Prior Art Fig. 2 Invention

Fig. 3 Result