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Method for Fabricating BEOL Resistor on Deformable and Flexible Substrates

IP.com Disclosure Number: IPCOM000246458D
Publication Date: 2016-Jun-08
Document File: 5 page(s) / 100K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is method for fabricating a BEOL (back end of line) resistor on a deformable and flexible substrate. The resistor is fabricated by forming trenches in a flexible and stretchable interlayer dielectric material, then depositing resistive material (poly-Si or poly-SiGe or resistive metal, like TaN). The unique geometry of the resistor structure allows it to be deformable and flexible.

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Method for Fabricating BEOL Resistor on Deformable and Flexible Substrates

Flexible and deformable substrates are an attractive option for upcoming Internet of Things (IoT) applications. Circuits fabricated on such substrates require resistors as part of technology offering. Such resistors must be flexible and deformable for such applications. In addition to flexibility, these structures need to be stretchable as well.

A method for fabricating a BEOL (back end of line) resistor on a deformable and flexible substrate is disclosed. The resistor is fabricated by forming trenches in a flexible and stretchable interlayer dielectric material, then depositing resistive material (poly-Si or poly-SiGe or resistive metal, like TaN). The unique geometry of the resistor structure allows it to be deformable and flexible.

Figure 1 to 10 provides various steps of the fabrication process for obtaining BEOL resistor on a deformable and flexible substrate.

The fabrication process starts with a flexible and deformable substrate as shown in figure 1.

Figure 1

As illustrated in figure 2, Front end of line transistor are fabricated.

Figure 2

As a next step, Interlayer dielectric deposition and CMP is performed as illustrated in figure 3.

1


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Figure 3


Thereafter, deformable interlayer dielectric deposition is performed as illustrated in figure 4.

Figure 4


Moving on, etching of deformable dielectric is performed as shown in figure 5.

Figure 5


Next, deposition of resistive ma...