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High Thermal BGA package design with thermal rings

IP.com Disclosure Number: IPCOM000246877D
Publication Date: 2016-Jul-11
Document File: 4 page(s) / 529K

Publishing Venue

The IP.com Prior Art Database

Abstract

Through changing core layer to metal and adding thermal ring, our Innovation can enhance BGA thermal dissipation capability. Thermal ring will be directly soldered to the PCB during SMT process, in this way package thermal dissipation capability can be enhanced.

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Page 01 of 4

High Thermal BGA Package Design with Thermal Rings

Through changing core layer to metal and adding thermal ring, our Innovation can enhance BGA thermal dissipation capability. Thermal ring will be directly soldered to the PCB during SMT process, in this way package thermal dissipation capability can be enhanced.

Background:

Current MAPBGA package has constraint for thermal dissipation, since it hasn't any EP area. And most heat has to dissipate through ball to PCB. In some cases, especially for power devices, a BGA package can't meet its thermal requirement for device performance.

Body:

Substrate -- thin dielectric layer manufacture study:

We apply epoxy plugging in place of thin dielectric layer. Hence, the process is as follows:

Abstract:


Page 02 of 4

Metal→ Lamination of dielectrical layer attached→ 1st drilling(big hole with mechanical method)→ Epoxy plugging→ 2nd drilling(small hole with laser method) → Chemical copper→ copper plating→ Circuit formation→ Solder mask.

Due to after SMT, solder balls thickness will have about 1/3-1/4 reduction. So that's easy to control package coplanarity.

We just need control T1 & T2 dimension, which is base on ball size.

The spec of T1 height will be set according to the statistical distribution of the collapsed solder balls (T2) so that T1 is within the tolerance of T2 during thermal ring attachment. T1= thermal ring thickness + TIM thickness + solder thickness

T2= solder ball thickness after reflow collaps...