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Self-Powered System-in-Package (SiP)

IP.com Disclosure Number: IPCOM000247558D
Publication Date: 2016-Sep-16
Document File: 2 page(s) / 141K

Publishing Venue

The IP.com Prior Art Database

Abstract

The present invention relates generally to integrated circuit (IC) packages. More specifically, the present invention relates to a self-powered system-in-packages (SiP) that is not required to solder down to a Printed Circuit Board (PCB).

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Self-Powered System-in-Package (SiP)

Abstract

The present invention relates generally to integrated circuit (IC) packages. More specifically, the present invention relates to a self-powered system-in-packages (SiP) that is not required to solder down to a Printed Circuit Board (PCB).

Introduction

IC packages are typically assembled, tested, and soldered down to PCB to gather power source and input signal in order to processing and provide functionality of the IC package. It is typical that consumers will continue to demand for a smaller and more cost effective finished product. SiP comes into a play because of the ability to reduce the PCB size by integrating multiple silicon chips and passives into a single IC package. However, what would be the next step for further finished product size reduction? The answer might be eliminating the PCB. Present invention is to make use of the concept of SiP by integrating a self- powered feature so that the package itself would not be required to solder down to a PCB. The self- powered feature could be of a solar cell(s), any type of battery connector (or re-chargeable battery), USB, or other possible ports that connect to the SiP directly. The self-powered SiP package's solder balls side or soldering pad would be replaced by the power connector source(s) solder footprint since the existing solder ball or solder pad footprint would no longer be required. The self-powered SiP may be targeted for low power consumption, very sm...