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Ultrathin leadless semiconductor package

IP.com Disclosure Number: IPCOM000247752D
Publication Date: 2016-Oct-05
Document File: 2 page(s) / 41K

Publishing Venue

The IP.com Prior Art Database

Abstract

Semiconductor packaging industry is driving towards miniaturization and reduced form factor. The customer board has limited space and therefore, higher functionality with smaller form factor is desirable. Substrate material has the highest contribution in the chip less package cost. The substrate material also increases the overall package thickness. Eliminating the package substrate completely from the microelectronic package will help in achieving an ultra-thin package with lower chip less package cost.

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Ultrathin leadless semiconductor package

Semiconductor packaging industry is driving towards miniaturization and reduced form factor. The customer board has limited space and therefore, higher functionality with smaller form factor is desirable. Substrate material has the highest contribution in the chip less package cost. The substrate material also increases the overall package thickness. Eliminating the package substrate completely from the microelectronic package will help in achieving an ultra-thin package with lower chip less package cost.

Proposed is an ultra-thin semiconductor package with no substrate (leadframe or laminate) in finished goods. Copper carrier plate is used as a temporary substrate. Standard die attach process is used to attach the die to the copper carrier plate. Die attach film or paste can be used for die attachment. Standard wire-bonding process is then followed to render flat profile to the wire loop. The wire looping re-distributes the finer die pad pitch to coarser package level pitch. Nickel plating is applied on the wires by dipping the inverted die into the plating bath, allowing the flat portion of the wire to be immersed in the plating bath. Partial or full plating can be done up to a thickness of 100-150 ┬Ám. The carrier plate is then encapsulated using known molding technologies like transfer molding, compression molding etc. The molding compound will then be grinded from the top to expose the thick portion of the plated wires. If the pl...