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Therma-Flex LED Lighting Substrate

IP.com Disclosure Number: IPCOM000248074D
Publication Date: 2016-Oct-24
Document File: 1 page(s) / 81K

Publishing Venue

The IP.com Prior Art Database

Abstract

This publication pertains to thermally efficient flexible printed circuit board constructions, in particular for high power general lighting applications, that can efficiently dissipate the heat, are cost competitive, and are alternative solutions to non-flexible material constructions such as, e.g., a construction including a copper layer on B stage FR-4 on a metal base, or a construction including a copper foil on a thermally conductive polyimide dielectric film on an aluminum sheet.

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Therma‐Flex LED Lighting Substrate 

 

This publication pertains to thermally efficient flexible printed circuit board constructions, in particular for high power general lighting applications, that can efficiently dissipate the heat, are cost competitive, and are alternative solutions to non-flexible material constructions such as, e.g., a construction including a copper layer on B stage FR-4 on a metal base, or a construction including a copper foil on a thermally conductive polyimide dielectric film on an aluminum sheet.

On example of the new thermally efficient flexible printed circuit board constructions is shown in Figure 1 and includes, from bottom to top, an aluminum heat sink, a pressure sensitive adhesive (PSA) layer, a nickel gold layer, a copper layer, a polyimide layer, and a white cover tape of white soldermask. Heat generated by the LED devices connected to the copper layer of the construction can then be efficiently dissipated by the construction.

Figure 1