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Resistive Device: Structure and Method

IP.com Disclosure Number: IPCOM000248351D
Publication Date: 2016-Nov-17
Document File: 5 page(s) / 283K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a structure and process method that includes a resistor structure consisting of multiple resistor stacks in order to facilitate extendibility.

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This is the abbreviated version, containing approximately 100% of the total text.

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Resistive Device : :

A resistor is one of the most common electrical components used in almost every electrical device. In semiconductor devices, it is well known to have thin film resistors embedded in chips through either a damascene approach or a subtractive etch method.

With the continual scaling of the feature size and available chip area for resistor elements, extendibility is becoming more limited and challenging.

Figure 1: Extendibility Concerns: Resistor

The novel contribution is a structure and process method that includes a resistor structure consisting of multiple resistor stacks. The resistor stacks can be either the same or the different materials. The resistor elements can have various thicknesses and levels of resistivity. The resistor structure has air gaps.

The method discloses RESISTOR structures with scaling feasibility. It provides a smaller horizontal area and higher resistance as well as design flexibility. The multiple resistor structure can be implemented in Front End of Line (FEOL) and Back End of Line (BEOL). The fabrication method can also use as a resistor trimming process.

The stacked structure increases the available device area and enhances the device performance.

Figure 2: Proposed structure

Structure and Method

Structure and Method

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