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Copper Post Formation in Stepped Laminate Interposer PoP

IP.com Disclosure Number: IPCOM000248384D
Publication Date: 2016-Nov-23
Document File: 2 page(s) / 226K

Publishing Venue

The IP.com Prior Art Database

Abstract

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Copper Post Formation in Stepped Laminate Interposer PoP

Background

The technology of embedded device substrates and packages has been developed for miniaturization and high functionality of electronic devices. The Molded Core embedded Package (MCeP) is developed shown in Fig. 1a, which consists of an upper substrate, a base substrate, and an embedded layer between thereof. A IC die without re-routing are mounted on inner surface of the base substrate. The upper substrate and the base substrate are connected electrically by copper core solder balls. The space between upper and base substrate is encapsulated by molding resin. In particular, the core technology of MCeP is the copper core solder ball (CCSB) which not only electrically connects the top package to the bottom package, but also permits a stable height between upper substrate and base substrate.

Figure 1a: Prior art - The Molded Core embedded Package (MCeP)

In Fig. 1b, the current method of MCeP adopts a stepped laminate interposer as the upper substrate to accommodate the chip inside the cavity to reduce the thickness. Copper pillars are formed throughout the stepped laminate interposer, and then connected to the base substrate through CCSBs. However, in the current method, it is not easy to produce uniform CCSBs with controlled diameters, which further prohibits a finer pitch in the device.

Figure 1b: The current method for The Molded Core embedded Package (MCeP)


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Copper Post Formation in...