Browse Prior Art Database

Stepped Interposer PoP with Spacer Film

IP.com Disclosure Number: IPCOM000248541D
Publication Date: 2016-Dec-15
Document File: 4 page(s) / 296K

Publishing Venue

The IP.com Prior Art Database

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 54% of the total text.

Stepped Interposer PoP with Spacer Film

Disclosed is an interposer for PoP having stepped feature formed by placing & peeling spacer

film and manufacturing method thereof. In conventional process, Cu-plating & etching is

performed on a carrier to form a stepped feature. The Cu-plating & etching is relatively high

cost. In our invention, spacer film is applied on the carrier to form a stepped feature. The

spacer film can be easily disposed on the site where the stepped feature is formed, and then

removed by peeling or stripping process. The invention provides low cost solution with

simplified process alternative to prior interposer manufacture.

Fig. 2 ~ 11 shows manufacturing process of present invention.

Referring now to Fig. 2, providing a carrier (detach core) phase. The carrier can include core,

a carrier top side metal and a carrier bottom side metal. The core can include SUS plate, FR4

plate, or polymer reinforced plate as examples. The carrier top side metal and the carrier

bottom side metal are detachable from the core. The carrier top side metal and the carrier

bottom side metal are preferably copper.

Fig. 3 shows disposing spacer film phase. The spacer film can include PI, PET, PEN, etc.

Adhesive can be formed with the spacer film. The adhesive can include pressure sensitive

adhesive (PSA), which can simplify manufacturing process because curing process is not

necessary. Anti-adhesion treatment can be applied to the top surface of the space film. The

anti-adhesion treatment facilitates peeling off the spacer film from the interposer after

lamination is finished.

Spacer film is provided and cut as the size of stepped feature. The spacer film is placed on the

carrier, particularly at the site where the stepped feature is formed. The spacer film is

attached by adhesive. It has been discovered that the disposing spacer film is lower cost than

conventional method. In conventional method, photolithography is performed to the carrier

except area where Cu to be plated, and then Cu is plated to form stepped feature. In the

invention, the process can be simplified by using spacer film cut & place.

Stepped Interposer PoP with Spacer Film

Fig. 4 shows insulation phase. The insulation layer is formed over the carrier and the spacer

film. Prepreg (PPG) is preferable.

Fig. 5 shows a core-separation phase of manufacture. The core of the carrier is removed and

the metal layer on the carrier top side and the carrier bottom side can be used to form the

base.

Referring now to Fig. 6, a plurality of via holes for Cu-post are formed in the insulation layer.

The via holes are formed by laser processing or drilling.

Stepped Interposer PoP with Spacer Film

Fig. 7 shows forming Cu-Post and forming conductive pattern layer. The plurality of the via

holes are plated with conductive metal, preferably Cu. Subse...